Start with the right materials, process with precision, and finished for success.

General Info

Centerline Technologies provides ultra-precision services for grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials — for the telecommunication, semiconductor, communication, test & measurement, micro-electronic, defense and security industries.

Extra Phones

Fax: 978-568-1334

Hours

Regular Hours

Mon - Fri:	8:00 am - 4:00 pm
Sat - Sun	Closed

Categories

Contract Manufacturing, Industrial Ceramic Products, Laser Cutting, Machine Shops, Polishes, Solid Surface Materials

Services/Products

LappingLaser MachiningEdge GrindingWafer DicingLaser ScribingBack GrindingCMPLaser DrillingSurface GrindingSubstrate EngineeringMaterials Inventory/ManagementPolishingVia Planarity Processing

SapphireSilicon CarbideAluminum Nitride (AlN) 170 W/mK, 200 W/mK, 230 W/mKFused Silica (SiO2)QuartzZirconiaFerriteSpecialty GlassAlumina (Al2O3) Ceramic Substrates 90%, 96%, 99.5%, 99.6%, 99.8%Beryllium Oxide (BeO) 99.5% purity. 285 W/mK or 325 W/mKSilicon Nitride (Si3N4) 90 W/mKSpecialty MetalsTungsten Carbide

Payment Options

Brands

CoorsTek, Toshiba, Materion, Dynasil, Rubicon, Gavish, Maruwa, CeramTec

Amenities

Centerline's inventory of substrate materials, (Al203, AlN, BeO, SiO2, Si3N4, Sapphire, Glass, etc.), from the industries best manufactures, enables us to offer lead times that meet your demands.

Accreditation

ISO 9001:2015 Customer Focus, Technical Excellence, and Continual Improvement

ITAR Compliant

Associations

iMAPS (International Microelectronics and Packaging Society),SPIE (The international society for optics and photonics),ASM International,ACerS (The American Ceramic Society)

AKA

Centerline Technologies

Other Links

Primary Website

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